This LED spotlight example demonstrates the value of simulating both the electrical and thermal aspects of power dissipating...
This schematic shows the electro-thermal characteristics of a "smart-phone" with Dynamic Thermal Management (DTM). The components...
The team recently released a new capability that I believe will revolutionize the electro-thermal design process! It is called BCI ROM (Boundary Condition Independent – Reduced Order Model) technology, a modeling approach to capture accurate thermal characteristics from a 3D/CFD analysis, ready for use in 1D circuit simulation.
This article describes a method to perform accurate electro-thermal simulations for circuits that operate in switch-mode. This approach addresses the fundamental problem of these divergent requirements:
• The need to simulate long periods of “virtual circuit operation”, due to long thermal settling times
• The need for small simulation time-steps, due to high switching frequencies and fast, non-linear device behavior
A colleague of mine, a thermal design engineer, once made a comment that I’ll never forget. I was simulating a power electronics circuit and I placed a scope probe on a transistor model and plotted the power dissipation. Its value was of course changing over time, as the circuit’s operating state was varied during the simulated test scenario. He exclaimed: “You have a Power Fairy!”