Modeling Transistor Amplifier Self-Heating - Thermal Network Mike DonnellyDesigner19 × Mike Donnelly Member for 10 years 4 months 1,529 designs 10 groups Title Description <p>This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.</p><p>The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).</p><p>From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.</p> About text formats Tags electro-thermalthermal crosstalk Select a tag from the list or create your own.Drag to re-order taxonomy terms. License - None - What's this? Design Titleby Mike Donnelly × Embed Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/embed-design/151471"></iframe> Embed Live Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/node/151471"></iframe> Share a Link Copy URL https://explore.partquest.com/node/151471 Copy of Modeling Transistor Amplifier Self-Heating - Thermal Network - on Mon, 09/25/2023 - 16:24 User-1695625685Designer249726 × User-1695625685 Member for 6 months 3 designs 1 groups Title Description <p>This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.</p> <p>The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).</p> <p>From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.</p> About text formats Tags electro-thermalthermal crosstalk Select a tag from the list or create your own.Drag to re-order taxonomy terms. License - None - What's this? Design Titleby User-1695625685 × Embed Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/embed-design/612972"></iframe> Embed Live Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/node/612972"></iframe> Share a Link Copy URL https://explore.partquest.com/node/612972 Copy of Modeling Transistor Amplifier Self-Heating - Thermal Network - on Mon, 09/18/2023 - 11:28 User-1695029883Designer249502 × User-1695029883 Member for 6 months 1 week 3 designs 1 groups Title Description <p>This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.</p> <p>The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).</p> <p>From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.</p> About text formats Tags electro-thermalthermal crosstalk Select a tag from the list or create your own.Drag to re-order taxonomy terms. License - None - What's this? Design Titleby User-1695029883 × Embed Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/embed-design/612327"></iframe> Embed Live Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/node/612327"></iframe> Share a Link Copy URL https://explore.partquest.com/node/612327 Copy of Modeling Transistor Amplifier Self-Heating - Thermal Network - on Fri, 09/08/2023 - 09:34 User-1693302130Designer248975 × User-1693302130 Member for 6 months 4 weeks 2 designs 1 groups Title Description <p>This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.</p> <p>The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).</p> <p>From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.</p> About text formats Tags electro-thermalthermal crosstalk Select a tag from the list or create your own.Drag to re-order taxonomy terms. License - None - What's this? Design Titleby User-1693302130 × Embed Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/embed-design/611286"></iframe> Embed Live Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/node/611286"></iframe> Share a Link Copy URL https://explore.partquest.com/node/611286 Copy of Modeling Transistor Amplifier Self-Heating - Thermal Network - on Thu, 03/04/2021 - 14:49 seiichiro.wakiyamaDesigner238434 × seiichiro.wakiyama Member for 3 years 5 designs 1 groups Title Description <p>This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.</p> <p>The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).</p> <p>From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.</p> About text formats Tags electro-thermalthermal crosstalk Select a tag from the list or create your own.Drag to re-order taxonomy terms. License - None - What's this? Design Titleby seiichiro.wakiyama × Embed Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/embed-design/416473"></iframe> Embed Live Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/node/416473"></iframe> Share a Link Copy URL https://explore.partquest.com/node/416473 Copy of Modeling Transistor Amplifier Self-Heating - Thermal Network - on Thu, 02/04/2021 - 14:09 hissaDesigner237843 × hissa Member for 3 years 1 month 0 designs 1 groups Title Description <p>This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.</p> <p>The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).</p> <p>From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.</p> About text formats Tags electro-thermalthermal crosstalk Select a tag from the list or create your own.Drag to re-order taxonomy terms. License - None - What's this? Design Titleby hissa × Embed Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/embed-design/406491"></iframe> Embed Live Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/node/406491"></iframe> Share a Link Copy URL https://explore.partquest.com/node/406491 Copy of Modeling Transistor Amplifier Self-Heating - Thermal Network - on Thu, 02/04/2021 - 14:09 hissaDesigner237843 × hissa Member for 3 years 1 month 0 designs 1 groups Title Description <p>This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.</p> <p>The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).</p> <p>From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.</p> About text formats Tags electro-thermalthermal crosstalk Select a tag from the list or create your own.Drag to re-order taxonomy terms. License - None - What's this? Design Titleby hissa × Embed Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/embed-design/406490"></iframe> Embed Live Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/node/406490"></iframe> Share a Link Copy URL https://explore.partquest.com/node/406490 Copy of Modeling Transistor Amplifier Self-Heating - Thermal Network - on Thu, 02/04/2021 - 14:09 hissaDesigner237843 × hissa Member for 3 years 1 month 0 designs 1 groups Title Description <p>This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.</p> <p>The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).</p> <p>From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.</p> About text formats Tags electro-thermalthermal crosstalk Select a tag from the list or create your own.Drag to re-order taxonomy terms. License - None - What's this? Design Titleby hissa × Embed Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/embed-design/406489"></iframe> Embed Live Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/node/406489"></iframe> Share a Link Copy URL https://explore.partquest.com/node/406489 Copy of Modeling Transistor Amplifier Self-Heating - Thermal Network - on Mon, 12/21/2020 - 15:23 Jay_6Designer202185 × Jay_6 Member for 5 years 6 months 3 designs 1 groups Title Description <p>This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.</p> <p>The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).</p> <p>From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.</p> About text formats Tags electro-thermalthermal crosstalk Select a tag from the list or create your own.Drag to re-order taxonomy terms. License - None - What's this? Design Titleby Jay_6 × Embed Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/embed-design/396477"></iframe> Embed Live Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/node/396477"></iframe> Share a Link Copy URL https://explore.partquest.com/node/396477 Copy of Modeling Transistor Amplifier Self-Heating - Thermal Network - on Fri, 08/21/2020 - 09:26 iijimaDesigner234228 × iijima Member for 3 years 7 months 1 designs 1 groups Title Description <p>This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.</p> <p>The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).</p> <p>From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.</p> About text formats Tags electro-thermalthermal crosstalk Select a tag from the list or create your own.Drag to re-order taxonomy terms. License - None - What's this? Design Titleby iijima × Embed Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/embed-design/334843"></iframe> Embed Live Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/node/334843"></iframe> Share a Link Copy URL https://explore.partquest.com/node/334843 Pagination Page 1 Next page ››
Copy of Modeling Transistor Amplifier Self-Heating - Thermal Network - on Mon, 09/25/2023 - 16:24 User-1695625685Designer249726 × User-1695625685 Member for 6 months 3 designs 1 groups Title Description <p>This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.</p> <p>The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).</p> <p>From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.</p> About text formats Tags electro-thermalthermal crosstalk Select a tag from the list or create your own.Drag to re-order taxonomy terms. License - None - What's this? Design Titleby User-1695625685 × Embed Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/embed-design/612972"></iframe> Embed Live Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/node/612972"></iframe> Share a Link Copy URL https://explore.partquest.com/node/612972 Copy of Modeling Transistor Amplifier Self-Heating - Thermal Network - on Mon, 09/18/2023 - 11:28 User-1695029883Designer249502 × User-1695029883 Member for 6 months 1 week 3 designs 1 groups Title Description <p>This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.</p> <p>The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).</p> <p>From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.</p> About text formats Tags electro-thermalthermal crosstalk Select a tag from the list or create your own.Drag to re-order taxonomy terms. License - None - What's this? Design Titleby User-1695029883 × Embed Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/embed-design/612327"></iframe> Embed Live Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/node/612327"></iframe> Share a Link Copy URL https://explore.partquest.com/node/612327 Copy of Modeling Transistor Amplifier Self-Heating - Thermal Network - on Fri, 09/08/2023 - 09:34 User-1693302130Designer248975 × User-1693302130 Member for 6 months 4 weeks 2 designs 1 groups Title Description <p>This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.</p> <p>The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).</p> <p>From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.</p> About text formats Tags electro-thermalthermal crosstalk Select a tag from the list or create your own.Drag to re-order taxonomy terms. License - None - What's this? Design Titleby User-1693302130 × Embed Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/embed-design/611286"></iframe> Embed Live Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/node/611286"></iframe> Share a Link Copy URL https://explore.partquest.com/node/611286 Copy of Modeling Transistor Amplifier Self-Heating - Thermal Network - on Thu, 03/04/2021 - 14:49 seiichiro.wakiyamaDesigner238434 × seiichiro.wakiyama Member for 3 years 5 designs 1 groups Title Description <p>This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.</p> <p>The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).</p> <p>From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.</p> About text formats Tags electro-thermalthermal crosstalk Select a tag from the list or create your own.Drag to re-order taxonomy terms. License - None - What's this? Design Titleby seiichiro.wakiyama × Embed Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/embed-design/416473"></iframe> Embed Live Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/node/416473"></iframe> Share a Link Copy URL https://explore.partquest.com/node/416473 Copy of Modeling Transistor Amplifier Self-Heating - Thermal Network - on Thu, 02/04/2021 - 14:09 hissaDesigner237843 × hissa Member for 3 years 1 month 0 designs 1 groups Title Description <p>This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.</p> <p>The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).</p> <p>From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.</p> About text formats Tags electro-thermalthermal crosstalk Select a tag from the list or create your own.Drag to re-order taxonomy terms. License - None - What's this? Design Titleby hissa × Embed Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/embed-design/406491"></iframe> Embed Live Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/node/406491"></iframe> Share a Link Copy URL https://explore.partquest.com/node/406491 Copy of Modeling Transistor Amplifier Self-Heating - Thermal Network - on Thu, 02/04/2021 - 14:09 hissaDesigner237843 × hissa Member for 3 years 1 month 0 designs 1 groups Title Description <p>This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.</p> <p>The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).</p> <p>From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.</p> About text formats Tags electro-thermalthermal crosstalk Select a tag from the list or create your own.Drag to re-order taxonomy terms. License - None - What's this? Design Titleby hissa × Embed Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/embed-design/406490"></iframe> Embed Live Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/node/406490"></iframe> Share a Link Copy URL https://explore.partquest.com/node/406490 Copy of Modeling Transistor Amplifier Self-Heating - Thermal Network - on Thu, 02/04/2021 - 14:09 hissaDesigner237843 × hissa Member for 3 years 1 month 0 designs 1 groups Title Description <p>This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.</p> <p>The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).</p> <p>From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.</p> About text formats Tags electro-thermalthermal crosstalk Select a tag from the list or create your own.Drag to re-order taxonomy terms. License - None - What's this? Design Titleby hissa × Embed Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/embed-design/406489"></iframe> Embed Live Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/node/406489"></iframe> Share a Link Copy URL https://explore.partquest.com/node/406489 Copy of Modeling Transistor Amplifier Self-Heating - Thermal Network - on Mon, 12/21/2020 - 15:23 Jay_6Designer202185 × Jay_6 Member for 5 years 6 months 3 designs 1 groups Title Description <p>This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.</p> <p>The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).</p> <p>From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.</p> About text formats Tags electro-thermalthermal crosstalk Select a tag from the list or create your own.Drag to re-order taxonomy terms. License - None - What's this? Design Titleby Jay_6 × Embed Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/embed-design/396477"></iframe> Embed Live Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/node/396477"></iframe> Share a Link Copy URL https://explore.partquest.com/node/396477 Copy of Modeling Transistor Amplifier Self-Heating - Thermal Network - on Fri, 08/21/2020 - 09:26 iijimaDesigner234228 × iijima Member for 3 years 7 months 1 designs 1 groups Title Description <p>This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.</p> <p>The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).</p> <p>From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.</p> About text formats Tags electro-thermalthermal crosstalk Select a tag from the list or create your own.Drag to re-order taxonomy terms. License - None - What's this? Design Titleby iijima × Embed Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/embed-design/334843"></iframe> Embed Live Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/node/334843"></iframe> Share a Link Copy URL https://explore.partquest.com/node/334843 Pagination Page 1 Next page ››
Copy of Modeling Transistor Amplifier Self-Heating - Thermal Network - on Mon, 09/18/2023 - 11:28 User-1695029883Designer249502 × User-1695029883 Member for 6 months 1 week 3 designs 1 groups Title Description <p>This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.</p> <p>The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).</p> <p>From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.</p> About text formats Tags electro-thermalthermal crosstalk Select a tag from the list or create your own.Drag to re-order taxonomy terms. License - None - What's this? Design Titleby User-1695029883 × Embed Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/embed-design/612327"></iframe> Embed Live Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/node/612327"></iframe> Share a Link Copy URL https://explore.partquest.com/node/612327 Copy of Modeling Transistor Amplifier Self-Heating - Thermal Network - on Fri, 09/08/2023 - 09:34 User-1693302130Designer248975 × User-1693302130 Member for 6 months 4 weeks 2 designs 1 groups Title Description <p>This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.</p> <p>The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).</p> <p>From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.</p> About text formats Tags electro-thermalthermal crosstalk Select a tag from the list or create your own.Drag to re-order taxonomy terms. License - None - What's this? Design Titleby User-1693302130 × Embed Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/embed-design/611286"></iframe> Embed Live Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/node/611286"></iframe> Share a Link Copy URL https://explore.partquest.com/node/611286 Copy of Modeling Transistor Amplifier Self-Heating - Thermal Network - on Thu, 03/04/2021 - 14:49 seiichiro.wakiyamaDesigner238434 × seiichiro.wakiyama Member for 3 years 5 designs 1 groups Title Description <p>This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.</p> <p>The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).</p> <p>From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.</p> About text formats Tags electro-thermalthermal crosstalk Select a tag from the list or create your own.Drag to re-order taxonomy terms. License - None - What's this? Design Titleby seiichiro.wakiyama × Embed Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/embed-design/416473"></iframe> Embed Live Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/node/416473"></iframe> Share a Link Copy URL https://explore.partquest.com/node/416473 Copy of Modeling Transistor Amplifier Self-Heating - Thermal Network - on Thu, 02/04/2021 - 14:09 hissaDesigner237843 × hissa Member for 3 years 1 month 0 designs 1 groups Title Description <p>This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.</p> <p>The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).</p> <p>From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.</p> About text formats Tags electro-thermalthermal crosstalk Select a tag from the list or create your own.Drag to re-order taxonomy terms. License - None - What's this? Design Titleby hissa × Embed Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/embed-design/406491"></iframe> Embed Live Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/node/406491"></iframe> Share a Link Copy URL https://explore.partquest.com/node/406491 Copy of Modeling Transistor Amplifier Self-Heating - Thermal Network - on Thu, 02/04/2021 - 14:09 hissaDesigner237843 × hissa Member for 3 years 1 month 0 designs 1 groups Title Description <p>This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.</p> <p>The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).</p> <p>From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.</p> About text formats Tags electro-thermalthermal crosstalk Select a tag from the list or create your own.Drag to re-order taxonomy terms. License - None - What's this? Design Titleby hissa × Embed Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/embed-design/406490"></iframe> Embed Live Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/node/406490"></iframe> Share a Link Copy URL https://explore.partquest.com/node/406490 Copy of Modeling Transistor Amplifier Self-Heating - Thermal Network - on Thu, 02/04/2021 - 14:09 hissaDesigner237843 × hissa Member for 3 years 1 month 0 designs 1 groups Title Description <p>This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.</p> <p>The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).</p> <p>From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.</p> About text formats Tags electro-thermalthermal crosstalk Select a tag from the list or create your own.Drag to re-order taxonomy terms. License - None - What's this? Design Titleby hissa × Embed Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/embed-design/406489"></iframe> Embed Live Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/node/406489"></iframe> Share a Link Copy URL https://explore.partquest.com/node/406489 Copy of Modeling Transistor Amplifier Self-Heating - Thermal Network - on Mon, 12/21/2020 - 15:23 Jay_6Designer202185 × Jay_6 Member for 5 years 6 months 3 designs 1 groups Title Description <p>This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.</p> <p>The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).</p> <p>From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.</p> About text formats Tags electro-thermalthermal crosstalk Select a tag from the list or create your own.Drag to re-order taxonomy terms. License - None - What's this? Design Titleby Jay_6 × Embed Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/embed-design/396477"></iframe> Embed Live Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/node/396477"></iframe> Share a Link Copy URL https://explore.partquest.com/node/396477 Copy of Modeling Transistor Amplifier Self-Heating - Thermal Network - on Fri, 08/21/2020 - 09:26 iijimaDesigner234228 × iijima Member for 3 years 7 months 1 designs 1 groups Title Description <p>This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.</p> <p>The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).</p> <p>From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.</p> About text formats Tags electro-thermalthermal crosstalk Select a tag from the list or create your own.Drag to re-order taxonomy terms. License - None - What's this? Design Titleby iijima × Embed Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/embed-design/334843"></iframe> Embed Live Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/node/334843"></iframe> Share a Link Copy URL https://explore.partquest.com/node/334843 Pagination Page 1 Next page ››
Copy of Modeling Transistor Amplifier Self-Heating - Thermal Network - on Fri, 09/08/2023 - 09:34 User-1693302130Designer248975 × User-1693302130 Member for 6 months 4 weeks 2 designs 1 groups Title Description <p>This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.</p> <p>The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).</p> <p>From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.</p> About text formats Tags electro-thermalthermal crosstalk Select a tag from the list or create your own.Drag to re-order taxonomy terms. License - None - What's this? Design Titleby User-1693302130 × Embed Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/embed-design/611286"></iframe> Embed Live Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/node/611286"></iframe> Share a Link Copy URL https://explore.partquest.com/node/611286 Copy of Modeling Transistor Amplifier Self-Heating - Thermal Network - on Thu, 03/04/2021 - 14:49 seiichiro.wakiyamaDesigner238434 × seiichiro.wakiyama Member for 3 years 5 designs 1 groups Title Description <p>This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.</p> <p>The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).</p> <p>From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.</p> About text formats Tags electro-thermalthermal crosstalk Select a tag from the list or create your own.Drag to re-order taxonomy terms. License - None - What's this? Design Titleby seiichiro.wakiyama × Embed Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/embed-design/416473"></iframe> Embed Live Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/node/416473"></iframe> Share a Link Copy URL https://explore.partquest.com/node/416473 Copy of Modeling Transistor Amplifier Self-Heating - Thermal Network - on Thu, 02/04/2021 - 14:09 hissaDesigner237843 × hissa Member for 3 years 1 month 0 designs 1 groups Title Description <p>This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.</p> <p>The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).</p> <p>From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.</p> About text formats Tags electro-thermalthermal crosstalk Select a tag from the list or create your own.Drag to re-order taxonomy terms. License - None - What's this? Design Titleby hissa × Embed Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/embed-design/406491"></iframe> Embed Live Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/node/406491"></iframe> Share a Link Copy URL https://explore.partquest.com/node/406491 Copy of Modeling Transistor Amplifier Self-Heating - Thermal Network - on Thu, 02/04/2021 - 14:09 hissaDesigner237843 × hissa Member for 3 years 1 month 0 designs 1 groups Title Description <p>This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.</p> <p>The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).</p> <p>From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.</p> About text formats Tags electro-thermalthermal crosstalk Select a tag from the list or create your own.Drag to re-order taxonomy terms. License - None - What's this? Design Titleby hissa × Embed Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/embed-design/406490"></iframe> Embed Live Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/node/406490"></iframe> Share a Link Copy URL https://explore.partquest.com/node/406490 Copy of Modeling Transistor Amplifier Self-Heating - Thermal Network - on Thu, 02/04/2021 - 14:09 hissaDesigner237843 × hissa Member for 3 years 1 month 0 designs 1 groups Title Description <p>This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.</p> <p>The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).</p> <p>From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.</p> About text formats Tags electro-thermalthermal crosstalk Select a tag from the list or create your own.Drag to re-order taxonomy terms. License - None - What's this? Design Titleby hissa × Embed Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/embed-design/406489"></iframe> Embed Live Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/node/406489"></iframe> Share a Link Copy URL https://explore.partquest.com/node/406489 Copy of Modeling Transistor Amplifier Self-Heating - Thermal Network - on Mon, 12/21/2020 - 15:23 Jay_6Designer202185 × Jay_6 Member for 5 years 6 months 3 designs 1 groups Title Description <p>This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.</p> <p>The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).</p> <p>From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.</p> About text formats Tags electro-thermalthermal crosstalk Select a tag from the list or create your own.Drag to re-order taxonomy terms. License - None - What's this? Design Titleby Jay_6 × Embed Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/embed-design/396477"></iframe> Embed Live Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/node/396477"></iframe> Share a Link Copy URL https://explore.partquest.com/node/396477 Copy of Modeling Transistor Amplifier Self-Heating - Thermal Network - on Fri, 08/21/2020 - 09:26 iijimaDesigner234228 × iijima Member for 3 years 7 months 1 designs 1 groups Title Description <p>This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.</p> <p>The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).</p> <p>From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.</p> About text formats Tags electro-thermalthermal crosstalk Select a tag from the list or create your own.Drag to re-order taxonomy terms. License - None - What's this? Design Titleby iijima × Embed Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/embed-design/334843"></iframe> Embed Live Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/node/334843"></iframe> Share a Link Copy URL https://explore.partquest.com/node/334843 Pagination Page 1 Next page ››
Copy of Modeling Transistor Amplifier Self-Heating - Thermal Network - on Thu, 03/04/2021 - 14:49 seiichiro.wakiyamaDesigner238434 × seiichiro.wakiyama Member for 3 years 5 designs 1 groups Title Description <p>This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.</p> <p>The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).</p> <p>From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.</p> About text formats Tags electro-thermalthermal crosstalk Select a tag from the list or create your own.Drag to re-order taxonomy terms. License - None - What's this? Design Titleby seiichiro.wakiyama × Embed Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/embed-design/416473"></iframe> Embed Live Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/node/416473"></iframe> Share a Link Copy URL https://explore.partquest.com/node/416473 Copy of Modeling Transistor Amplifier Self-Heating - Thermal Network - on Thu, 02/04/2021 - 14:09 hissaDesigner237843 × hissa Member for 3 years 1 month 0 designs 1 groups Title Description <p>This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.</p> <p>The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).</p> <p>From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.</p> About text formats Tags electro-thermalthermal crosstalk Select a tag from the list or create your own.Drag to re-order taxonomy terms. License - None - What's this? Design Titleby hissa × Embed Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/embed-design/406491"></iframe> Embed Live Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/node/406491"></iframe> Share a Link Copy URL https://explore.partquest.com/node/406491 Copy of Modeling Transistor Amplifier Self-Heating - Thermal Network - on Thu, 02/04/2021 - 14:09 hissaDesigner237843 × hissa Member for 3 years 1 month 0 designs 1 groups Title Description <p>This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.</p> <p>The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).</p> <p>From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.</p> About text formats Tags electro-thermalthermal crosstalk Select a tag from the list or create your own.Drag to re-order taxonomy terms. License - None - What's this? Design Titleby hissa × Embed Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/embed-design/406490"></iframe> Embed Live Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/node/406490"></iframe> Share a Link Copy URL https://explore.partquest.com/node/406490 Copy of Modeling Transistor Amplifier Self-Heating - Thermal Network - on Thu, 02/04/2021 - 14:09 hissaDesigner237843 × hissa Member for 3 years 1 month 0 designs 1 groups Title Description <p>This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.</p> <p>The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).</p> <p>From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.</p> About text formats Tags electro-thermalthermal crosstalk Select a tag from the list or create your own.Drag to re-order taxonomy terms. License - None - What's this? Design Titleby hissa × Embed Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/embed-design/406489"></iframe> Embed Live Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/node/406489"></iframe> Share a Link Copy URL https://explore.partquest.com/node/406489 Copy of Modeling Transistor Amplifier Self-Heating - Thermal Network - on Mon, 12/21/2020 - 15:23 Jay_6Designer202185 × Jay_6 Member for 5 years 6 months 3 designs 1 groups Title Description <p>This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.</p> <p>The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).</p> <p>From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.</p> About text formats Tags electro-thermalthermal crosstalk Select a tag from the list or create your own.Drag to re-order taxonomy terms. License - None - What's this? Design Titleby Jay_6 × Embed Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/embed-design/396477"></iframe> Embed Live Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/node/396477"></iframe> Share a Link Copy URL https://explore.partquest.com/node/396477 Copy of Modeling Transistor Amplifier Self-Heating - Thermal Network - on Fri, 08/21/2020 - 09:26 iijimaDesigner234228 × iijima Member for 3 years 7 months 1 designs 1 groups Title Description <p>This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.</p> <p>The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).</p> <p>From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.</p> About text formats Tags electro-thermalthermal crosstalk Select a tag from the list or create your own.Drag to re-order taxonomy terms. License - None - What's this? Design Titleby iijima × Embed Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/embed-design/334843"></iframe> Embed Live Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/node/334843"></iframe> Share a Link Copy URL https://explore.partquest.com/node/334843 Pagination Page 1 Next page ››
Copy of Modeling Transistor Amplifier Self-Heating - Thermal Network - on Thu, 02/04/2021 - 14:09 hissaDesigner237843 × hissa Member for 3 years 1 month 0 designs 1 groups Title Description <p>This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.</p> <p>The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).</p> <p>From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.</p> About text formats Tags electro-thermalthermal crosstalk Select a tag from the list or create your own.Drag to re-order taxonomy terms. License - None - What's this? Design Titleby hissa × Embed Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/embed-design/406491"></iframe> Embed Live Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/node/406491"></iframe> Share a Link Copy URL https://explore.partquest.com/node/406491 Copy of Modeling Transistor Amplifier Self-Heating - Thermal Network - on Thu, 02/04/2021 - 14:09 hissaDesigner237843 × hissa Member for 3 years 1 month 0 designs 1 groups Title Description <p>This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.</p> <p>The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).</p> <p>From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.</p> About text formats Tags electro-thermalthermal crosstalk Select a tag from the list or create your own.Drag to re-order taxonomy terms. License - None - What's this? Design Titleby hissa × Embed Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/embed-design/406490"></iframe> Embed Live Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/node/406490"></iframe> Share a Link Copy URL https://explore.partquest.com/node/406490 Copy of Modeling Transistor Amplifier Self-Heating - Thermal Network - on Thu, 02/04/2021 - 14:09 hissaDesigner237843 × hissa Member for 3 years 1 month 0 designs 1 groups Title Description <p>This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.</p> <p>The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).</p> <p>From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.</p> About text formats Tags electro-thermalthermal crosstalk Select a tag from the list or create your own.Drag to re-order taxonomy terms. License - None - What's this? Design Titleby hissa × Embed Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/embed-design/406489"></iframe> Embed Live Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/node/406489"></iframe> Share a Link Copy URL https://explore.partquest.com/node/406489 Copy of Modeling Transistor Amplifier Self-Heating - Thermal Network - on Mon, 12/21/2020 - 15:23 Jay_6Designer202185 × Jay_6 Member for 5 years 6 months 3 designs 1 groups Title Description <p>This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.</p> <p>The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).</p> <p>From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.</p> About text formats Tags electro-thermalthermal crosstalk Select a tag from the list or create your own.Drag to re-order taxonomy terms. License - None - What's this? Design Titleby Jay_6 × Embed Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/embed-design/396477"></iframe> Embed Live Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/node/396477"></iframe> Share a Link Copy URL https://explore.partquest.com/node/396477 Copy of Modeling Transistor Amplifier Self-Heating - Thermal Network - on Fri, 08/21/2020 - 09:26 iijimaDesigner234228 × iijima Member for 3 years 7 months 1 designs 1 groups Title Description <p>This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.</p> <p>The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).</p> <p>From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.</p> About text formats Tags electro-thermalthermal crosstalk Select a tag from the list or create your own.Drag to re-order taxonomy terms. License - None - What's this? Design Titleby iijima × Embed Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/embed-design/334843"></iframe> Embed Live Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/node/334843"></iframe> Share a Link Copy URL https://explore.partquest.com/node/334843 Pagination Page 1 Next page ››
Copy of Modeling Transistor Amplifier Self-Heating - Thermal Network - on Thu, 02/04/2021 - 14:09 hissaDesigner237843 × hissa Member for 3 years 1 month 0 designs 1 groups Title Description <p>This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.</p> <p>The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).</p> <p>From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.</p> About text formats Tags electro-thermalthermal crosstalk Select a tag from the list or create your own.Drag to re-order taxonomy terms. License - None - What's this? Design Titleby hissa × Embed Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/embed-design/406490"></iframe> Embed Live Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/node/406490"></iframe> Share a Link Copy URL https://explore.partquest.com/node/406490 Copy of Modeling Transistor Amplifier Self-Heating - Thermal Network - on Thu, 02/04/2021 - 14:09 hissaDesigner237843 × hissa Member for 3 years 1 month 0 designs 1 groups Title Description <p>This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.</p> <p>The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).</p> <p>From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.</p> About text formats Tags electro-thermalthermal crosstalk Select a tag from the list or create your own.Drag to re-order taxonomy terms. License - None - What's this? Design Titleby hissa × Embed Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/embed-design/406489"></iframe> Embed Live Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/node/406489"></iframe> Share a Link Copy URL https://explore.partquest.com/node/406489 Copy of Modeling Transistor Amplifier Self-Heating - Thermal Network - on Mon, 12/21/2020 - 15:23 Jay_6Designer202185 × Jay_6 Member for 5 years 6 months 3 designs 1 groups Title Description <p>This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.</p> <p>The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).</p> <p>From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.</p> About text formats Tags electro-thermalthermal crosstalk Select a tag from the list or create your own.Drag to re-order taxonomy terms. License - None - What's this? Design Titleby Jay_6 × Embed Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/embed-design/396477"></iframe> Embed Live Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/node/396477"></iframe> Share a Link Copy URL https://explore.partquest.com/node/396477 Copy of Modeling Transistor Amplifier Self-Heating - Thermal Network - on Fri, 08/21/2020 - 09:26 iijimaDesigner234228 × iijima Member for 3 years 7 months 1 designs 1 groups Title Description <p>This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.</p> <p>The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).</p> <p>From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.</p> About text formats Tags electro-thermalthermal crosstalk Select a tag from the list or create your own.Drag to re-order taxonomy terms. License - None - What's this? Design Titleby iijima × Embed Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/embed-design/334843"></iframe> Embed Live Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/node/334843"></iframe> Share a Link Copy URL https://explore.partquest.com/node/334843 Pagination Page 1 Next page ››
Copy of Modeling Transistor Amplifier Self-Heating - Thermal Network - on Thu, 02/04/2021 - 14:09 hissaDesigner237843 × hissa Member for 3 years 1 month 0 designs 1 groups Title Description <p>This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.</p> <p>The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).</p> <p>From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.</p> About text formats Tags electro-thermalthermal crosstalk Select a tag from the list or create your own.Drag to re-order taxonomy terms. License - None - What's this? Design Titleby hissa × Embed Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/embed-design/406489"></iframe> Embed Live Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/node/406489"></iframe> Share a Link Copy URL https://explore.partquest.com/node/406489 Copy of Modeling Transistor Amplifier Self-Heating - Thermal Network - on Mon, 12/21/2020 - 15:23 Jay_6Designer202185 × Jay_6 Member for 5 years 6 months 3 designs 1 groups Title Description <p>This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.</p> <p>The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).</p> <p>From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.</p> About text formats Tags electro-thermalthermal crosstalk Select a tag from the list or create your own.Drag to re-order taxonomy terms. License - None - What's this? Design Titleby Jay_6 × Embed Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/embed-design/396477"></iframe> Embed Live Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/node/396477"></iframe> Share a Link Copy URL https://explore.partquest.com/node/396477 Copy of Modeling Transistor Amplifier Self-Heating - Thermal Network - on Fri, 08/21/2020 - 09:26 iijimaDesigner234228 × iijima Member for 3 years 7 months 1 designs 1 groups Title Description <p>This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.</p> <p>The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).</p> <p>From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.</p> About text formats Tags electro-thermalthermal crosstalk Select a tag from the list or create your own.Drag to re-order taxonomy terms. License - None - What's this? Design Titleby iijima × Embed Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/embed-design/334843"></iframe> Embed Live Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/node/334843"></iframe> Share a Link Copy URL https://explore.partquest.com/node/334843 Pagination Page 1 Next page ››
Copy of Modeling Transistor Amplifier Self-Heating - Thermal Network - on Mon, 12/21/2020 - 15:23 Jay_6Designer202185 × Jay_6 Member for 5 years 6 months 3 designs 1 groups Title Description <p>This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.</p> <p>The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).</p> <p>From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.</p> About text formats Tags electro-thermalthermal crosstalk Select a tag from the list or create your own.Drag to re-order taxonomy terms. License - None - What's this? Design Titleby Jay_6 × Embed Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/embed-design/396477"></iframe> Embed Live Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/node/396477"></iframe> Share a Link Copy URL https://explore.partquest.com/node/396477 Copy of Modeling Transistor Amplifier Self-Heating - Thermal Network - on Fri, 08/21/2020 - 09:26 iijimaDesigner234228 × iijima Member for 3 years 7 months 1 designs 1 groups Title Description <p>This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.</p> <p>The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).</p> <p>From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.</p> About text formats Tags electro-thermalthermal crosstalk Select a tag from the list or create your own.Drag to re-order taxonomy terms. License - None - What's this? Design Titleby iijima × Embed Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/embed-design/334843"></iframe> Embed Live Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/node/334843"></iframe> Share a Link Copy URL https://explore.partquest.com/node/334843 Pagination Page 1 Next page ››
Copy of Modeling Transistor Amplifier Self-Heating - Thermal Network - on Fri, 08/21/2020 - 09:26 iijimaDesigner234228 × iijima Member for 3 years 7 months 1 designs 1 groups Title Description <p>This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.</p> <p>The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).</p> <p>From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.</p> About text formats Tags electro-thermalthermal crosstalk Select a tag from the list or create your own.Drag to re-order taxonomy terms. License - None - What's this? Design Titleby iijima × Embed Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/embed-design/334843"></iframe> Embed Live Design Copy Embed Code <iframe allowfullscreen="true" referrerpolicy="origin-when-cross-origin" frameborder="0" width="100%" height="720" scrolling="no" src="https://explore.partquest.com/node/334843"></iframe> Share a Link Copy URL https://explore.partquest.com/node/334843 Pagination Page 1 Next page ››