electro-thermal | PartQuest™ Explore

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Designer19

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11 years 7 months

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Member of the PartQuest Explore Development Team. Focused on modeling and simulation of analog, mixed-signal and multi-discipline systems covering a broad range of applications, including power electronics, controls and mechatronic systems.

Description

This example shows the capability of modeling the electrothermal aspects of power dissipating circuits. The design is a 5V regulator (non-switching), driven from a 120 Vac/60 Hz input and using a transformer/rectifier circuit to step down to a much lower DC-link voltage.

The load current capability is 5A, which is well above the current limit of the linear regular component itself. This is thanks to the load sharing role of the bypass PNP transistor. The design is based on an example application circuit shown in Figure 11 of the On Semiconductor Datasheet MC7800/D, November 2014 - Rev. 27.

All of the power dissipating electronics' models are from the "Thermal and Electro-thermal" Components Library. They have a thermal port that connects to the thermal network (i.e. red wires). These models output all the power dissipated in the device as a thermal heat-flow into that network. This includes the rectifier diodes, the linear regulator and the BJT, as well as the current sense resistor and the effective winding resistances of the transformer primary and secondary.

The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (1 degC/Watt), as well as the datasheet published values for the junction-to-lead thermal resistances of all the active electronic components. An assumed value for the thermal capacitance of the BJT (0.005 J/degC, not provided by the manufacturer) was added for purposes of illustration. Obtaining the actual value would require deeper analysis or measurement of this important component characteristic. However, in this example, both thermal capacitance values were selected solely to give sufficiently fast thermal time constants, so that steady-state operating temperatures could be reached with minimal simulation time.

This design is based on another shared design:

<a href="https://explore.partquest.com/node/666395">https://explore.partquest.com/node/666395</a>

That design has been modified not only to add the electrothermal aspects, but it was also adjusted to improve its observed thermal performance. For example, the DC-link capacitance (c3) was increased from 4700uF to 22000uF, to allow a reduced DC-link operating voltage (i.e. to improve efficiency) while avoiding regulation drop-out at AC zero-crossings under heavy load conditions.

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Modeling Transistor Amplifier Self-Heating - Thermal Network

Designer19

Member for

11 years 7 months

1,833

designs

10

groups

Member of the PartQuest Explore Development Team. Focused on modeling and simulation of analog, mixed-signal and multi-discipline systems covering a broad range of applications, including power electronics, controls and mechatronic systems.

Description

This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.

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Test Fuse with Lamp Load JSAE 2025

Designer241497

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3 years 9 months

164

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I'm a member of the PartQuest Explore Promoto.

Description

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Modeling Transistor Amplifier Self-Heating - Thermal Network JSAE 2025

Designer241497

Member for

3 years 9 months

164

designs

6

groups

I'm a member of the PartQuest Explore Promoto.

Description

This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.

The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).

From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.

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Copy of Modeling Transistor Amplifier Self-Heating - Thermal Network - on Mon, 03/10/2025 - 12:35

Designer261842

Member for

3 months 3 weeks

8

designs

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Welcome to the community!!

Description

This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.

The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).

From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.

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Copy of Modeling Transistor Amplifier Self-Heating - Thermal Network - on Fri, 01/17/2025 - 21:34

Designer260001

Member for

7 months

4

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Welcome to the community!!

Description

This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.

The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).

From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.

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Copy of Modeling Transistor Amplifier Self-Heating - Thermal Network - on Wed, 01/15/2025 - 16:03

Designer260730

Member for

5 months 3 weeks

3

designs

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Welcome to the community!!

Description

This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.

The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).

From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.

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Copy of Modeling Transistor Amplifier Self-Heating - Thermal Network - on Fri, 01/10/2025 - 13:28

Designer260641

Member for

5 months 3 weeks

1

designs

2

groups

Welcome to the community!!

Description

This example shows the importance of modeling thermal interaction effects, or "thermal crosstalk", in power dissipating circuits. The "design" is a simple transistor amplifier, using just an 8 Ohm pull-up resistor and an active pull-down NPN BJT. Both of these models are from our "Thermal and Electro-thermal" Components Library, so they have a thermal port that can connect to an external thermal network. These models output all power dissipated in the device as a thermal heat-flow into that network.

The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (10 degC/Watt). This assumes the resistor and transistor contribute heat to the same heat-sink. The transistor's thermal heat-flow path also includes an 8.8 degC/Watt resistance, to represent the Junction-to-Lead Thermal Resistance as published in the device datasheet (Diodes Inc. FZT869).

From the simulation results it is clear that the heat-sink temperature rises to nearly 120 degC (purple waveform), causing the transistor's junction temperature to approach 150 degC (average, red waveform). This is significantly higher than the value predicted in the companion design example: "Modeling Transistor Amplifier Self-Heating - Hot Part Monitor", which assumed the two devices were thermally isolated.

About text formats

Copy of Electro-thermal Trade-off Analysis for AC-DC Converter with Current Boost Regulator - on Fri, 12/13/2024 - 13:52

Designer259061

Member for

8 months 2 weeks

18

designs

1

groups

Welcome to the community!!

Description

This example shows the capability of modeling the electrothermal aspects of power dissipating circuits. The design is a 5V regulator (non-switching), driven from a 120 Vac/60 Hz input and using a transformer/rectifier circuit to step down to a much lower DC-link voltage.

The load current capability is 5A, which is well above the current limit of the linear regular component itself. This is thanks to the load sharing role of the bypass PNP transistor. The design is based on an example application circuit shown in Figure 11 of the On Semiconductor Datasheet MC7800/D, November 2014 - Rev. 27.

All of the power dissipating electronics' models are from the "Thermal and Electro-thermal" Components Library. They have a thermal port that connects to the thermal network (i.e. red wires). These models output all the power dissipated in the device as a thermal heat-flow into that network. This includes the rectifier diodes, the linear regulator and the BJT, as well as the current sense resistor and the effective winding resistances of the transformer primary and secondary.

The thermal network includes the heat-sink's heat capacitance (0.1 J/degC) and heat transfer resistance to the ambient (1 degC/Watt), as well as the datasheet published values for the junction-to-lead thermal resistances of all the active electronic components. An assumed value for the thermal capacitance of the BJT (0.005 J/degC, not provided by the manufacturer) was added for purposes of illustration. Obtaining the actual value would require deeper analysis or measurement of this important component characteristic. However, in this example, both thermal capacitance values were selected solely to give sufficiently fast thermal time constants, so that steady-state operating temperatures could be reached with minimal simulation time.

This design is based on another shared design:

<a href="https://explore.partquest.com/node/666395">https://explore.partquest.com/node/666395</a>

That design has been modified not only to add the electrothermal aspects, but it was also adjusted to improve its observed thermal performance. For example, the DC-link capacitance (c3) was increased from 4700uF to 22000uF, to allow a reduced DC-link operating voltage (i.e. to improve efficiency) while avoiding regulation drop-out at AC zero-crossings under heavy load conditions.

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Copy of LED Driver with Auto-Dimming for Thermal Protection - on Tue, 12/10/2024 - 10:13

Designer260185

Member for

6 months 3 weeks

2

designs

1

groups

Welcome to the community!!

Description

This LED lighting example demonstrates the value of simulating both the electrical and thermal* aspects of power dissipating circuits together, simultaneously.

In this application example, a Vishay NTCS0603 Thermistor provides feedback of the enclosure temperature. This feedback is used to control PWM dimming of the LEDs, thereby limiting the internal temperature when operating at high external ambient temperature conditions.

This is a "Live" design, the user can change key parameter values and then run new simulations to see the results. These parameters include "r_mirror", the resistance of the current mirror that controls the capacitor charging rate of the 555 timer, and thereby set the PWM frequency. The user can also change "r_offset" that controls the temperature level at which the dimming operation begins. Finally, the user can set "r_iLED_set", to control the ON-state operating current of the LEDs.

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* To reduce the time needed to simulate the transition and settling at 6 different temperature levels, all thermal time constants were reduced by approximately 1000x. The actual thermal response time constant of the NTCS0603 is approximately 3 seconds (depends on mounting), not 3 msec! Also, the enclosure thermal capacitance value would more likely be 3 (J/degC) instead of 3 (mJ/degC), giving a thermal time constant for the enclosure of 10 (degC/Watt) * 3 (J/degC) = 30 seconds. This time scaling does not affect the static relationship between the outside temperature and PWM dimming.

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