This model of a buck converter uses a “state-average” abstraction (i.e. the actual switching effect is removed by averaging), so that it simulates very quickly. The model includes component heating that was calibrated "in situ" using the companion switching version of the design:

https://www.systemvision.com/node/408827

The BCI ROM models of the components and the full PCB were generated by Simcenter Flotherm. They are based on a detailed 3D/CFD thermal analysis. These models provide an accurate dynamic thermal response to the time-varying component heat flows, for the represented board layout.